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    Heatsinking in laser devices
    1.
    发明授权
    Heatsinking in laser devices 有权

    公开(公告)号：US12237643B2

    公开(公告)日：2025-02-25

    申请号：US17302964

    申请日：2021-05-17

    Applicant: Cisco Technology, Inc.

    Inventor： Norbert Schlepple ,  Jock T. Bovington ,  Mary Nadeau ,  Mittu Pannala ,  Jarrett S. Neiman

    IPC: H01S5/024 ,  H01S5/02 ,  H01S5/02326

    Abstract: Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.

    Coupling multi-channel laser to multicore fiber
    2.
    发明授权
    Coupling multi-channel laser to multicore fiber 有权

    公开(公告)号：US11662532B2

    公开(公告)日：2023-05-30

    申请号：US17643312

    申请日：2021-12-08

    Applicant: Cisco Technology, Inc.

    Inventor： Norbert Schlepple ,  Jock T. Bovington

    IPC: G02B6/42 ,  G02B6/02

    CPC classification number: G02B6/4204 ,  G02B6/02042 ,  G02B6/4226

    Abstract: Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

    Package self-heating using multi-channel laser
    3.
    发明授权
    Package self-heating using multi-channel laser 有权

    公开(公告)号：US11600964B2

    公开(公告)日：2023-03-07

    申请号：US16995729

    申请日：2020-08-17

    Applicant: Cisco Technology, Inc.

    Inventor： Jock T. Bovington ,  Norbert Schlepple

    IPC: H01S5/024 ,  H01S3/067 ,  B23K101/14

    Abstract: Aspects described herein include a method of fabricating an optical component. The method comprises electrically coupling different laser channels of a laser die to different electrical leads, testing a respective optical coupling of each of the different laser channels, optically aligning an optical fiber with a first laser channel of the different laser channels having the greatest optical coupling, and designating a second laser channel of the different laser channels as a heater element for the first laser channel.

    Photonic integrated circuit bonded with interposer
    4.
    发明授权
    Photonic integrated circuit bonded with interposer 有权

    公开(公告)号：US10564352B1

    公开(公告)日：2020-02-18

    申请号：US16543441

    申请日：2019-08-16

    Applicant: Cisco Technology, Inc.

    Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

    Abstract: Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

    Photonic integrated circuit bonded with interposer
    6.
    发明授权
    Photonic integrated circuit bonded with interposer 有权

    公开(公告)号：US10393959B1

    公开(公告)日：2019-08-27

    申请号：US16172702

    申请日：2018-10-26

    Applicant: Cisco Technology, Inc.

    Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

    Abstract: A method comprises bonding a first surface of an interposer wafer with a first exterior surface of a photonic wafer assembly. The photonic wafer assembly comprises one or more optical devices coupled with one or more metal layers and with one or more first optical waveguides. The method further comprises forming, from a second surface opposite the first surface, a plurality of first conductive vias extending at least partway through the interposer wafer and coupled with the one or more metal layers. The method further comprises forming, at the second surface, a plurality of first conductive pads coupled with the plurality of first conductive vias. The method further comprises forming one or more second conductive pads coupled with the one or more metal layers. The one or more second conductive pads are accessible at a second exterior surface of the photonic wafer assembly opposite the first exterior surface.

    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips
    10.
    发明授权
    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips 有权

    公开(公告)号：US11378751B2

    公开(公告)日：2022-07-05

    申请号：US16923852

    申请日：2020-07-08

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

    IPC: G02B6/30 ,  G02B6/26 ,  G02B6/42

    Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

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