- 专利标题: Polymide precursor resin composition
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申请号: US14654740申请日: 2013-12-13
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公开(公告)号: US10725379B2公开(公告)日: 2020-07-28
- 发明人: Keishi Ono , Tetsuya Enomoto , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
- 申请人: Hitachi Chemical DuPont MicroSystems, Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical DuPont MicroSystems, Ltd.
- 当前专利权人: Hitachi Chemical DuPont MicroSystems, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Merchant & Gould, P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d7fcdf3
- 国际申请: PCT/JP2013/007345 WO 20131213
- 国际公布: WO2014/097594 WO 20140626
- 主分类号: G03F7/038
- IPC分类号: G03F7/038 ; G03F7/075 ; G03F7/40 ; C08G73/10 ; C08K5/544 ; C08K5/33 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; C09D179/08 ; C08K5/5455 ; C08F290/14
摘要:
A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R5 is an alkyl group having 1 to 4 carbon atoms, R6 is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R7 is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R8 is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R9 is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R8 and R9 may independently have a substituent.
公开/授权文献
- US20150337116A1 POLYMIDE PRECURSOR RESIN COMPOSITION 公开/授权日:2015-11-26
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