Invention Grant
- Patent Title: High-frequency module
-
Application No.: US16199456Application Date: 2018-11-26
-
Publication No.: US10732367B2Publication Date: 2020-08-04
- Inventor: Shigemi Kurashima , Mitsuki Kanda , Takatoshi Yagisawa , Masahiro Yanagi
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@585297cb
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H05K9/00 ; H01Q17/00
Abstract:
A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.
Public/Granted literature
- US20190219781A1 HIGH-FREQUENCY MODULE Public/Granted day:2019-07-18
Information query
