Invention Grant
- Patent Title: Vacuum chuck with polymeric embossments
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Application No.: US14764436Application Date: 2014-02-11
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Publication No.: US10734270B2Publication Date: 2020-08-04
- Inventor: John Glasko , Richard A. Cooke , I-Kuan Lin
- Applicant: Entegris, Inc.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc.
- International Application: PCT/US2014/015735 WO 20140211
- International Announcement: WO2014/126896 WO 20140821
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687
Abstract:
A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
Public/Granted literature
- US20150380294A1 Vacuum Chuck with Polymeric Embossments Public/Granted day:2015-12-31
Information query
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