Invention Grant
- Patent Title: Printed circuit boards including drive circuits, and related semiconductor devices
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Application No.: US15653117Application Date: 2017-07-18
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Publication No.: US10741628B2Publication Date: 2020-08-11
- Inventor: Minhwa Jang , Jungeun Koo , Yechung Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a9299c8
- Main IPC: H01L27/32
- IPC: H01L27/32 ; G09G3/20 ; G09G3/3225 ; H01L51/00

Abstract:
Semiconductor devices are provided. A semiconductor device includes a substrate, a controller on the substrate, first and second drive circuits on the substrate, and a plurality of signal lines on the substrate that connect the controller to the first and second drive circuits. The plurality of signal lines are each at the same vertical level and are horizontally spaced apart from each other. Related printed circuit boards are also provided.
Public/Granted literature
- US20180026089A1 PRINTED CIRCUIT BOARDS INCLUDING DRIVE CIRCUITS, AND RELATED SEMICONDUCTOR DEVICES Public/Granted day:2018-01-25
Information query
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