公开(公告)号：US11508651B2

公开(公告)日：2022-11-22

申请号：US16874120

申请日：2020-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungeun Koo ,  Yechung Chung

IPC: H01L23/498 ,  H01L21/66 ,  H01L23/00 ,  H01L23/49 ,  H01L25/07 ,  H01L23/538

Abstract: A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.

公开(公告)号：US20230077996A1

公开(公告)日：2023-03-16

申请号：US18051141

申请日：2022-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungeun Koo ,  Yechung Chung

IPC: H01L23/498 ,  H01L21/66 ,  H01L23/00 ,  H01L23/49 ,  H01L25/07

Abstract: A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.

公开(公告)号：US20210074622A1

公开(公告)日：2021-03-11

申请号：US16874120

申请日：2020-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungeun Koo ,  Yechung Chung

IPC: H01L23/498 ,  H01L21/66 ,  H01L23/00

Abstract: A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.

公开(公告)号：US20230361054A1

公开(公告)日：2023-11-09

申请号：US18115545

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin SEOL ,  Jungeun Koo ,  Tongsuk Kim ,  Youngjun Yoon ,  Mijeong Jeong ,  Younghun Jung

IPC: H01L23/58 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16 ,  H01Q9/04

CPC classification number: H01L23/585 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/16 ,  H01Q9/0407

Abstract: Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistribution layer, a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer, an encapsulant on the semiconductor chip, at least one antenna pattern on the encapsulant, a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer, and electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer, wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices.

公开(公告)号：US10741628B2

公开(公告)日：2020-08-11

申请号：US15653117

申请日：2017-07-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minhwa Jang ,  Jungeun Koo ,  Yechung Chung

IPC: H01L27/32 ,  G09G3/20 ,  G09G3/3225 ,  H01L51/00

Abstract: Semiconductor devices are provided. A semiconductor device includes a substrate, a controller on the substrate, first and second drive circuits on the substrate, and a plurality of signal lines on the substrate that connect the controller to the first and second drive circuits. The plurality of signal lines are each at the same vertical level and are horizontally spaced apart from each other. Related printed circuit boards are also provided.