Invention Grant
- Patent Title: Dielectric and isolation lower Fin material for Fin-based electronics
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Application No.: US16435250Application Date: 2019-06-07
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Publication No.: US10741640B2Publication Date: 2020-08-11
- Inventor: Walid M. Hafez , Chia-Hong Jan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/40 ; H01L29/808 ; H01L29/8605 ; H01L27/098

Abstract:
A dielectric and isolation lower fin material is described that is useful for fin-based electronics. In some examples, a dielectric layer is on first and second sidewalls of a lower fin. The dielectric layer has a first upper end portion laterally adjacent to the first sidewall of the lower fin and a second upper end portion laterally adjacent to the second sidewall of the lower fin. An isolation material is laterally adjacent to the dielectric layer directly on the first and second sidewalls of the lower fin and a gate electrode is over a top of and laterally adjacent to sidewalls of an upper fin. The gate electrode is over the first and second upper end portions of the dielectric layer and the isolation material.
Public/Granted literature
- US20190296105A1 DIELECTRIC AND ISOLATION LOWER FIN MATERIAL FOR FIN-BASED ELECTRONICS Public/Granted day:2019-09-26
Information query
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