Invention Grant
- Patent Title: Method for controlling heat dissipation device and electronic device with function of controlling heat dissipation device
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Application No.: US15921687Application Date: 2018-03-15
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Publication No.: US10750635B2Publication Date: 2020-08-18
- Inventor: Jo-Hua Wu , Cheng-Yu Chen
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corporation
- Current Assignee: Realtek Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33c2a8f6
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G05B15/02 ; G06F1/20

Abstract:
A heat dissipation device control method for dissipating heat from an electronic element without self-heat-dissipation function in an electronic device. The method comprises: detecting a first temperature of the electronic element; and controlling the fan of the peripheral element located around the electronic element when the first temperature exceeds the first upper temperature threshold to dissipate the heat from the electronic element.
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