- Patent Title: Techniques for mitigating temperature spikes and dissipating heat
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Application No.: US16118654Application Date: 2018-08-31
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Publication No.: US10750640B2Publication Date: 2020-08-18
- Inventor: Sean Charles Andrews , Seong Heon Jeong , William Henry Von Novak, III
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C09K5/00 ; G06F1/20 ; C09K5/06

Abstract:
Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.
Public/Granted literature
- US20190159364A1 TECHNIQUES FOR MITIGATING TEMPERATURE SPIKES AND DISSIPATING HEAT Public/Granted day:2019-05-23
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