Invention Grant
- Patent Title: Build material analysis
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Application No.: US15562361Application Date: 2015-06-19
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Publication No.: US10751946B2Publication Date: 2020-08-25
- Inventor: Isabel Sanz Ananos , Santiago Sanz Ananos , Sergi Culubret
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/EP2015/063837 WO 20150619
- International Announcement: WO2016/202404 WO 20161222
- Main IPC: B33Y70/00
- IPC: B33Y70/00 ; B29C64/393 ; B33Y50/00 ; B29C64/35 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02 ; B29C64/153
Abstract:
According to one example there is provided a build material measurement module to determine build material characteristics from a build material to be analyzed.
Public/Granted literature
- US20180050493A1 BUILD MATERIAL ANALYSIS Public/Granted day:2018-02-22
Information query
