A method of manufacturing an imprint master template including forming a cutting line guide at an edge of a first fine pattern unit having an upper surface on which a fine pattern is formed; cutting a wafer substrate by a cleaving process along the cutting line guide so that a cutting surface is formed, the cutting surface having a preliminary second surface where the cutting line guide was formed and a first surface which is formed by the cleaving process; polishing the preliminary second surface to form a second surface which is inclined at a predetermined angle with respect to the first surface; and bonding the first fine pattern unit and the second fine pattern unit to each other with the first surface of the first fine pattern unit facing the first surface of the second fine pattern unit.