Invention Grant
- Patent Title: Dissipating heat of heating elements
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Application No.: US16323219Application Date: 2016-10-20
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Publication No.: US10752015B2Publication Date: 2020-08-25
- Inventor: Reynaldo V Villavelez , Terry McMahon , Donald W Schulte
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Trop, Pruner & Hu, P.C.
- International Application: PCT/US2016/057824 WO 20161020
- International Announcement: WO2018/075039 WO 20180426
- Main IPC: B41J2/345
- IPC: B41J2/345 ; B41J2/335

Abstract:
In some examples, a heater assembly for a pattern forming system includes a support, and heating elements mounted on the support, where the heating elements are to, in response to activation of the heating element, produce heat directed towards a target to form a pattern on the target. A heat sink is thermally connected to the heating elements and comprising a pattern of heat dissipation surfaces comprising channels to dissipate heat produced by the heating elements.
Public/Granted literature
- US20190248157A1 DISSIPATING HEAT OF HEATING ELEMENTS Public/Granted day:2019-08-15
Information query
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