Invention Grant
- Patent Title: Optical receptacle, optical module and method for producing optical module
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Application No.: US16090334Application Date: 2017-02-24
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Publication No.: US10754106B2Publication Date: 2020-08-25
- Inventor: Shimpei Morioka , Ayano Kon , Koki Ono
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74ea9188
- International Application: PCT/JP2017/007102 WO 20170224
- International Announcement: WO2017/169390 WO 20171005
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
The optical receptacle of the present invention comprises an optical receptacle body and a support member. The optical receptacle body comprises: a first optical surface upon which is incident light transmitted from the photoelectric conversion element; a second optical surface that emits light transmitted from the photoelectric conversion element to the light transmission medium. The support member comprises a support member body that includes a mounting surface for mounting on a substrate, and a second mating part that mates with the first mating part and that is positioned at a position on the inside of the support member body at a position corresponding to the first mating part. The optical receptacle is positioned on the support member side of the mounting surface.
Public/Granted literature
- US20190121037A1 OPTICAL RECEPTACLE, OPTICAL MODULE AND METHOD FOR PRODUCING OPTICAL MODULE Public/Granted day:2019-04-25
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