• Patent Title: Optical receptacle, optical module and method for producing optical module
  • Application No.: US16090334
    Application Date: 2017-02-24
  • Publication No.: US10754106B2
    Publication Date: 2020-08-25
  • Inventor: Shimpei MoriokaAyano KonKoki Ono
  • Applicant: Enplas Corporation
  • Applicant Address: JP Saitama
  • Assignee: Enplas Corporation
  • Current Assignee: Enplas Corporation
  • Current Assignee Address: JP Saitama
  • Agency: Brundidge & Stanger, P.C.
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74ea9188
  • International Application: PCT/JP2017/007102 WO 20170224
  • International Announcement: WO2017/169390 WO 20171005
  • Main IPC: G02B6/42
  • IPC: G02B6/42
Optical receptacle, optical module and method for producing optical module
Abstract:
The optical receptacle of the present invention comprises an optical receptacle body and a support member. The optical receptacle body comprises: a first optical surface upon which is incident light transmitted from the photoelectric conversion element; a second optical surface that emits light transmitted from the photoelectric conversion element to the light transmission medium. The support member comprises a support member body that includes a mounting surface for mounting on a substrate, and a second mating part that mates with the first mating part and that is positioned at a position on the inside of the support member body at a position corresponding to the first mating part. The optical receptacle is positioned on the support member side of the mounting surface.
Information query
Patent Agency Ranking
0/0