Invention Grant
- Patent Title: Hot spot and process window monitoring
-
Application No.: US16431330Application Date: 2019-06-04
-
Publication No.: US10755016B2Publication Date: 2020-08-25
- Inventor: Boris Golovanevsky
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F30/39 ; G03F7/20

Abstract:
Metrology overlay targets are provided, as well as method of monitoring process shortcomings. Targets comprise periodic structures, at least one of which comprising repeating asymmetric elements along a corresponding segmentation direction of the periodic structure. The asymmetry of the elements may be designed in different ways, for example as repeating asymmetric sub-elements along a direction perpendicular to the segmentation direction of the elements. The asymmetry of the sub-elements may be designed in different ways, according to the type of monitored process shortcomings, such as various types of hot spots, line edge shortening, process windows parameters and so forth. Results of the measurements may be used to improve the process and/or increase the accuracy of the metrology measurements.
Public/Granted literature
- US20190286781A1 Hot Spot and Process Window Monitoring Public/Granted day:2019-09-19
Information query