A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.