公开(公告)号：US10755958B2

公开(公告)日：2020-08-25

申请号：US16364833

申请日：2019-03-26

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Yoshiyuki Arai

IPC: H01L21/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00

Abstract: A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.

公开(公告)号：US10181460B2

公开(公告)日：2019-01-15

申请号：US15562501

申请日：2016-03-29

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Noboru Asahi ,  Yoshiyuki Arai ,  Yoshinori Miyamoto ,  Shimpei Aoki ,  Masatsugu Nimura

IPC: H01L21/00 ,  H01L25/00 ,  H01L21/78 ,  H01L21/67 ,  H01L23/00 ,  H01L25/065 ,  B28D5/02

Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts.

公开(公告)号：US11495571B2

公开(公告)日：2022-11-08

申请号：US16326512

申请日：2017-08-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Yoshiyuki Arai

IPC: H01L23/00 ,  H01L33/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/60 ,  H01L33/32

Abstract: A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.