Invention Grant
- Patent Title: Heat dissipation assembly and electronic device
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Application No.: US16683287Application Date: 2019-11-14
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Publication No.: US10756000B2Publication Date: 2020-08-25
- Inventor: Linfang Jin , Yongwang Xiao , Guoping Wang , Jie Zou , Hualin Li
- Applicant: Huawei Device Co., Ltd.
- Applicant Address: CN Dongguan
- Assignee: Huawei Device Co., Ltd.
- Current Assignee: Huawei Device Co., Ltd.
- Current Assignee Address: CN Dongguan
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/552 ; H01L23/367 ; H01L23/373

Abstract:
The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
Public/Granted literature
- US20200083144A1 HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE Public/Granted day:2020-03-12
Information query
IPC分类: