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公开(公告)号：US10481654B2
公开(公告)日：2019-11-19
申请号：US15878017
申请日：2018-01-23
Applicant: Huawei Device Co., Ltd.
Inventor： Xiangyang Yang , Linfang Jin , Hualin Li , Wenbing Tang , Jie Zou
Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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公开(公告)号：US20140266016A1
公开(公告)日：2014-09-18
申请号：US14291530
申请日：2014-05-30
Applicant: Huawei Device Co., Ltd.
Inventor： Hualin Li , Linfang Jin , Liechun Zhou
IPC: H02J7/00
CPC classification number: H02J7/0029 , H01M10/443 , H01M10/486 , H02J7/0052 , H02J7/007 , H02J7/0091 , H02J7/047
Abstract: A charging circuit and a charger are provided. The charging circuit includes a temperature detection unit, a charging unit, and a control unit. In the present invention, the charging circuit adjusts a magnitude of a charging current according to a temperature of a product being charged or the charger and then controls the temperature of the product being charged or the charger, thereby greatly improving user experience, and enhancing safety performance of the product with a heat protection function.
Abstract translation: 提供充电电路和充电器。 充电电路包括温度检测单元，充电单元和控制单元。 在本发明中，充电电路根据正在充电的产品的温度或充电器来调节充电电流的大小，然后控制正在充电的产品的温度或充电器，从而大大提高用户体验，并提高安全性 具有防热功能的产品性能。
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Patent Agency Ranking
公开(公告)号：US10756000B2
公开(公告)日：2020-08-25
申请号：US16683287
申请日：2019-11-14
Applicant: Huawei Device Co., Ltd.
Inventor： Linfang Jin , Yongwang Xiao , Guoping Wang , Jie Zou , Hualin Li
IPC: H01L23/427 , H01L23/552 , H01L23/367 , H01L23/373
Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号：US09910468B2
公开(公告)日：2018-03-06
申请号：US15127705
申请日：2014-03-21
Applicant: HUAWEI DEVICE CO., LTD.
Inventor： Xiangyang Yang , Linfang Jin , Hualin Li , Wenbing Tang , Jie Zou
CPC classification number: G06F1/203 , G06F1/1626 , H05K1/0203
Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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公开(公告)号：US09768096B2
公开(公告)日：2017-09-19
申请号：US15123484
申请日：2014-03-20
Applicant: HUAWEI DEVICE CO., LTD.
Inventor： Longping Yan , Konggang Wei , Hualin Li
IPC: H01L23/427 , H01L21/48 , H01L23/367
CPC classification number: H01L23/427 , H01L21/4882 , H01L23/3675 , H01L2924/0002 , H01L2924/00
Abstract: A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.
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公开(公告)号：US09363884B2
公开(公告)日：2016-06-07
申请号：US14072199
申请日：2013-11-05
Applicant: Huawei Device Co., Ltd.
Inventor： Jun Yang , Liechun Zhou , Hualin Li , Xijie Wu
IPC: H05K7/20 , H05K1/02 , H05K9/00 , H01L23/552 , H01L23/00
CPC classification number: H05K1/0204 , H01L23/552 , H01L24/18 , H05K1/0216 , H05K7/20472 , H05K9/003 , H05K2201/0715 , H05K2201/2018 , Y02D70/122 , Y10T428/264 , Y10T428/30 , Y10T428/31504 , Y10T428/31678
Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.
Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。
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公开(公告)号：US20140055957A1
公开(公告)日：2014-02-27
申请号：US14072199
申请日：2013-11-05
Applicant: Huawei Device Co., Ltd.
Inventor： Jun Yang , Liechun Zhou , Hualin Li , Xijie Wu
IPC: H05K1/02
CPC classification number: H05K1/0204 , H01L23/552 , H01L24/18 , H05K1/0216 , H05K7/20472 , H05K9/003 , H05K2201/0715 , H05K2201/2018 , Y02D70/122 , Y10T428/264 , Y10T428/30 , Y10T428/31504 , Y10T428/31678
Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.
Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。
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