A semiconductor package includes: a connection member having first and second surfaces opposing each other and including a redistribution layer; a support member disposed on the first surface of the connection member, including a cavity, and having an inner sidewall surrounding the cavity of which an upper region is chamfered; a semiconductor chip disposed on the connection member in the cavity and having connection pads electrically connected to the redistribution layer; at least one electronic component disposed between the semiconductor chip and the inner sidewall and having connection terminals electrically connected to the redistribution layer; and an encapsulant encapsulating the semiconductor chip and the at least one electronic component disposed in the cavity.