Invention Grant
- Patent Title: Electronic package and method for fabricating the same
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Application No.: US15993243Application Date: 2018-05-30
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Publication No.: US10756438B2Publication Date: 2020-08-25
- Inventor: Han-Hung Chen , Chun-Yi Huang , Chang-Fu Lin , Rung-Jeng Lin , Kuo-Hua Yu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1a66ad35
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/22 ; H05K1/14 ; H05K1/18 ; H05K1/11 ; H05K1/02 ; H05K3/36
Abstract:
An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.
Public/Granted literature
- US20190273321A1 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2019-09-05
Information query
