Invention Grant
- Patent Title: Heat sink
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Application No.: US16779146Application Date: 2020-01-31
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Publication No.: US10760855B2Publication Date: 2020-09-01
- Inventor: Yosuke Watanabe , Tatsuro Miura , Toshiaki Nakamura , Kenya Kawabata , Yoshikatsu Inagaki
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d2e0a6f
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/04 ; F28D15/02 ; F28F9/22 ; H05K7/20 ; F28D21/00

Abstract:
The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.The heat sink includes: a heat transport member having a heat receiving portion thermally connected to a heat-generating element and including a first wick structure; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member and including a second wick structure; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which, the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, the internal space of the heat transport member communicating with an internal space of the tube body, and the first wick structure includes a branch portion branched in a thickness direction of the heat transport member and multi-stage stem parts extending from the branch portion in a predetermined direction.
Public/Granted literature
- US10718572B2 Heat sink Public/Granted day:2020-07-21
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