An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the two or more cameras, and perform a photometric calibration between the first camera and the second camera based on a portion of the first image corresponding to the detected feature and a portion of the second image corresponding to the matched feature. Other embodiments are disclosed and claimed.