Invention Grant
- Patent Title: Electronic component
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Application No.: US16166493Application Date: 2018-10-22
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Publication No.: US10763042B2Publication Date: 2020-09-01
- Inventor: Shinya Onodera , Takehisa Tamura , Atsushi Takeda , Ken Morita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@645f7cfa
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/012 ; H01G4/30 ; H01G4/252 ; H01L41/047 ; H01G2/06 ; H01G4/12 ; H01G4/248 ; H01F27/29 ; H01C7/00 ; H01F17/00 ; H01C7/18 ; H01C1/148

Abstract:
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.
Public/Granted literature
- US20190131072A1 ELECTRONIC COMPONENT Public/Granted day:2019-05-02
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