- Patent Title: Integrated heat spreader having electromagnetically-formed features
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Application No.: US14998122Application Date: 2015-12-23
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Publication No.: US10763188B2Publication Date: 2020-09-01
- Inventor: Aravindha R. Antoniswamy , Thomas John Fitzgerald , Kumaran Murugesan Chakravarthy , Syadwad Jain , Wei Hu , Zhizhong Tang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L23/367 ; H01L23/00
Abstract:
Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.
Public/Granted literature
- US20170186628A1 Integrated heat spreader having electromagnetically-formed features Public/Granted day:2017-06-29
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