Invention Grant
- Patent Title: Method of manufacturing semiconductor devices and corresponding semiconductor device
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Application No.: US16212581Application Date: 2018-12-06
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Publication No.: US10763192B2Publication Date: 2020-09-01
- Inventor: Dario Vitello
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IL Agrate Brianza
- Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee Address: IL Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1653485b
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/00

Abstract:
A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.
Public/Granted literature
- US20190181075A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Public/Granted day:2019-06-13
Information query
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