Invention Grant
- Patent Title: Package on package memory interface and configuration with error code correction
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Application No.: US16114419Application Date: 2018-08-28
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Publication No.: US10767998B2Publication Date: 2020-09-08
- Inventor: Rahul Gulati , Aishwarya Dubey , Nainala Vyagrheswarudu , Vasant Easwaran , Prashant Dinkar Karandikar , Mihir Mody
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ebby Abraham; Charles A. Brill; Frank D. Cimino
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4ededfe8
- Main IPC: G01C21/20
- IPC: G01C21/20 ; G06F11/10

Abstract:
Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors. In a second instance, the interfacing circuitry selectively communicates data bits along a first set of the number of conductors and error correction bits along a second set of the number of conductors.
Public/Granted literature
- US20180364051A1 Package On Package Memory Interface and Configuration With Error Code Correction Public/Granted day:2018-12-20
Information query
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