Invention Grant
- Patent Title: Printed circuit board component cover
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Application No.: US15543206Application Date: 2015-01-29
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Publication No.: US10772186B2Publication Date: 2020-09-08
- Inventor: Adolfo Gomez , Tom J. Searby , Andrew L. Wiltzius
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Fabian VanCott
- International Application: PCT/US2015/013492 WO 20150129
- International Announcement: WO2016/122522 WO 20160804
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K5/03 ; H05K5/02 ; B29C51/00 ; B29C51/26 ; B29C65/48 ; B29C65/56 ; B29K69/00 ; B29L31/34
Abstract:
A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.
Public/Granted literature
- US20180279462A1 PRINTED CIRCUIT BOARD COMPONENT COVER Public/Granted day:2018-09-27
Information query
