Invention Grant
- Patent Title: Methods and apparatus providing thermal isolation of photonic devices
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Application No.: US16105755Application Date: 2018-08-20
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Publication No.: US10777722B2Publication Date: 2020-09-15
- Inventor: Roy Meade , Gurtej Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L33/64 ; G02F1/01 ; G02F1/313 ; G02B6/12
Abstract:
Described embodiments include photonic integrated circuits and systems with photonic devices, including thermal isolation regions for the photonic devices. Methods of fabricating such circuits and systems are also described.
Public/Granted literature
- US20190013452A1 METHODS AND APPARATUS PROVIDING THERMAL ISOLATION OF PHOTONIC DEVICES Public/Granted day:2019-01-10
Information query
IPC分类:
