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公开(公告)号：US11621379B2
公开(公告)日：2023-04-04
申请号：US17181780
申请日：2021-02-22
申请人： NICHIA CORPORATION
IPC分类号： H01L33/00 , H01L33/54 , H01L33/50 , H01L33/48 , H01L25/075 , H01L33/56 , H01L33/30 , H01L33/62 , H01L33/64
摘要： A light-emitting device 100 includes: a light-emitting element; a light-transmissive member covering the light-emitting element; and a light-diffusing agent contained in the light-transmissive member and comprising hollow particles. The light-transmissive member has a first surface having irregularities according to the light-diffusing agent. The first surface of the light-transmissive member has a convex shape with a height gradually increased from a peripheral portion of the first surface toward a central portion of the first surface.
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公开(公告)号：US20230103072A1
公开(公告)日：2023-03-30
申请号：US17747351
申请日：2022-05-18
发明人： RICHARD FLOYD , ASIF KHAN , MIKHAIL GAEVSKI , MVS CHANDRASHEKHAR , GREGORY SIMIN
摘要： A 1.8-times improved light extraction efficiency (LEE) is reported under DC test conditions for truncated cone AlGaN DUV micropixel LEDs when the pixel size was reduced from 90 to 5 µm. This is shown to be a direct consequence of the absorption of the TM-polarized photons travelling in a direction parallel to the device epitaxial layers. Presently disclosed cathodoluminescence measurements show the lateral absorption length for 275 nm DUV photons to be 15 µm, which is ~1000 times shorter than that for waveguiding in the A0.65Ga0.35N cladding layers. Results show the re-absorption of this laterally travelling emission by the multiple quantum wells and the p-contact GaN layer to be a key factor limiting the LEE. Hence, for DUV emitters, scaling down to sub-20 µm device dimensions is critical for maximizing LEE. Presently disclosed sub-20 µm AIGaN-based LEDs do not show pronounced edge recombination effects. The peak light output power was further increased for all the devices after the addition of a semi -reflective Al2O3/Al heat spreader despite the reduction in sidewall reflectivity.
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公开(公告)号：US20230099496A1
公开(公告)日：2023-03-30
申请号：US17760131
申请日：2021-02-22
申请人： ARKEMA FRANCE
发明人： Thierry AUBERT , Rémi LE BEC , Fernand DELGADO
摘要： A lamp for a photochemical reactor, including: a support member made of a material having a thermal conductivity greater than or equal to 100W/mK at 20° C. and including at least one channel configured to contain a coolant fluid; at least one printed circuit mounted on the support member; and at least one light-emitting diode mounted on the printed circuit. A photochemical reactor including such a lamp, and a method for preparing a cycloalkanone oxime or a lactam using such a lamp.
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公开(公告)号：US11610935B2
公开(公告)日：2023-03-21
申请号：US16831378
申请日：2020-03-26
申请人： Lumileds LLC
发明人： Tze Yang Hin , Qing Xue
IPC分类号： H01L27/15 , H01L21/768 , H01L21/683 , H01L23/00 , H01L21/78 , H01L21/48 , H01L33/62 , H01L33/64 , H01L21/60
摘要： Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.
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公开(公告)号：US11569427B1
公开(公告)日：2023-01-31
申请号：US17947319
申请日：2022-09-19
申请人： Bruce H. Baretz
发明人： Bruce H. Baretz
摘要： A light emitting assembly comprising at least one of each of a solid state device and a thermal radiation source, couplable with a power supply constructed and arranged to power the solid state device and the thermal radiation source, to emit from the solid state device a first, relatively shorter wavelength radiation, and to emit from the thermal radiation source non-visible infrared radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and the infrared radiation, and which in exposure to said first, relatively shorter wavelength radiation, and infrared radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue light output from a light-emitting diode is down-converted to white light by packaging the diode and the thermal radiation device with fluorescent or phosphorescent organic and/or inorganic fluorescers and phosphors in an enclosure.
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公开(公告)号：US11569426B2
公开(公告)日：2023-01-31
申请号：US17185131
申请日：2021-02-25
摘要： A light irradiation unit includes a substrate having a longitudinal direction, the longitudinal direction being a first axis direction; multiple light sources arranged along the first axis direction on a first surface of the substrate; a heat dissipation member arranged on a second surface of the substrate opposite to the first surface; and a housing having a pair of first side surfaces holding the heat dissipation member therebetween in a second axis direction orthogonal to the first axis direction along the first surface. The substrate has, at an end portion in the first axis direction, an end surface intersecting the first axis direction. The location of the end surface in the first axis direction is near an edge of the first side surface along the first axis direction. The end surface is exposed from the housing or covered by a detachable protection member.
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公开(公告)号：US20230023295A1
公开(公告)日：2023-01-26
申请号：US17385139
申请日：2021-07-26
发明人： Fu-Bang CHEN , Chih-Chiang CHANG , Chang-Ching HUANG , Chun-Ming LAI , Wen-Hsing HUANG , Tzeng-Guang TSAI , Kuo-Hsin HUANG
摘要： The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.
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公开(公告)号：US20230021495A1
公开(公告)日：2023-01-26
申请号：US17947319
申请日：2022-09-19
申请人： Bruce H. BARETZ
发明人： Bruce H. BARETZ
摘要： A light emitting assembly comprising at least one of each of a solid state device and a thermal radiation source, couplable with a power supply constructed and arranged to power the solid state device and the thermal radiation source, to emit from the solid state device a first, relatively shorter wavelength radiation, and to emit from the thermal radiation source non-visible infrared radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and the infrared radiation, and which in exposure to said first, relatively shorter wavelength radiation, and infrared radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue light output from a light-emitting diode is down-converted to white light by packaging the diode and the thermal radiation device with fluorescent or phosphorescent organic and/or inorganic fluorescers and phosphors in an enclosure.
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公开(公告)号：US20220418157A1
公开(公告)日：2022-12-29
申请号：US17853513
申请日：2022-06-29
申请人： Jason DuBose , Megan Pham
发明人： Jason DuBose , Megan Pham
IPC分类号： H05K7/20 , H01L25/075 , H01L33/64 , A61L2/26 , A61L2/10
摘要： A device for disinfecting surfaces is provided. One embodiment has a plurality of UV light (energy) emitting LEDs residing in an enclosure, wherein emitted UV energy passes through a lens onto a surface being disinfected; a heat dissipator that receives heat generated by the UV emitting LEDs; and a fluid moving device. The enclosure has a fluid heating passageway that is in fluid contact with the heat dissipator, has a transfer passageway with a distal end that is fluidly coupled to a proximal end of the fluid heating passageway, and has a return passageway that is fluidly coupled to a proximal end of the transfer passageway and that is fluidly coupled to a distal end of the fluid heating passageway. During operation, the fluid moving device operates to circulate a cooling fluid through the fluid heating passageway, the transfer passageway, and the return passageway. Heat transfers to the ambient environment.
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公开(公告)号：US20220392820A1
公开(公告)日：2022-12-08
申请号：US17833153
申请日：2022-06-06
发明人： Romain COFFY , Younes BOUTALEB
IPC分类号： H01L23/367 , H01L33/64 , H01L31/024 , H01L33/58 , H01L31/0232 , H01L33/62 , H01L31/02 , H01L23/00
摘要： A cap is mounted to a support substrate, the cap including a cap body and an optical shutter. The cap and support substrate define a housing. An electronic chip is disposed in the housing above the support substrate. A face of the electronic chip supports an optical device that is optically coupled with the optical shutter. The cap body is thermally conductive. Within the housing, a thermally conductive linking structure is coupled in a thermally conductive manner between the cap body and the electronic chip. The thermally conductive linking structure surrounds the electronic chip. A thermal interface material fills a portion of the housing between the thermally conductive linking structure and the cap body.
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