公开(公告)号：US20240339582A1

公开(公告)日：2024-10-10

申请号：US18743884

申请日：2024-06-14

申请人： Micron Technology, Inc.

发明人： Kevin Tetz ,  Charles M. Watkins

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52

CPC分类号： H01L33/64 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/52 ,  H01L33/644 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075

摘要： Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US12107206B1

公开(公告)日：2024-10-01

申请号：US18515492

申请日：2023-11-21

申请人： HKC CORPORATION LIMITED

发明人： Yang Pu ,  Haijiang Yuan

IPC分类号： H01L29/205 ,  H01L25/16 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/641 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/0066

摘要： A display panel includes a drive backplane, the drive backplane being provided with a binding layer for fixing a light-emitting chip, and the display panel further includes a photoresistor disposed on a surface of the drive backplane and arranged close to the binding layer, the photoresistor having a resistance for being increased when the light-emitting chip is in an abnormal state, and the binding layer being configured to be in a molten state under an action of heat generated by the photoresistor when the light-emitting chip is in the abnormal state. The technical solution of the present application can reduce the damage of the binding layer and ensure that the normal light-emitting chip can be effectively repaired and replaced.

公开(公告)号：US12107194B2

公开(公告)日：2024-10-01

申请号：US17417904

申请日：2019-12-27

申请人： WAVELORD CO., LTD.

发明人： Sang Jeong An

IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L33/641

摘要： Disclosed is a semiconductor light emitting device comprising a semiconductor light emitting chip having electrodes; a mold, which has a first surface roughness and includes a bottom portion where the semiconductor light emitting chip is arranged and through holes formed in the bottom portion, with the through holes being comprised of a surface having a second surface roughness different from the first surface roughness, wherein at least one side of the mold facing the semiconductor light emitting chip is made of a material capable of reflecting at least 95% of light emitted by the semiconductor light emitting chip; and conductive parts provided in the through holes for electrical communication with the electrodes.

公开(公告)号：US12100693B2

公开(公告)日：2024-09-24

申请号：US18067186

申请日：2022-12-16

申请人： CreeLED, Inc.

发明人： Charles Chak Hau Pang ,  Victor Yue Kwong Lau ,  Tiancai Su

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L25/13 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L25/13 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647

摘要： LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.

公开(公告)号：US12095000B2

公开(公告)日：2024-09-17

申请号：US17035913

申请日：2020-09-29

申请人： Sensor Electronic Technology, Inc.

发明人： Michael Shur ,  Grigory Simin ,  Alexander Dobrinsky

IPC分类号： H01L33/06 ,  G06F30/30 ,  H01L31/02 ,  H01L31/0224 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/0392 ,  H01L31/18 ,  H01L33/00 ,  H01L33/08 ,  H01L33/12 ,  H01L33/30 ,  H01L33/32 ,  H01L33/40 ,  H01L33/42 ,  H01L33/46 ,  H01L33/64 ,  H01L33/38 ,  H01S5/30 ,  H01S5/343

CPC分类号： H01L33/06 ,  G06F30/30 ,  H01L31/02005 ,  H01L31/022466 ,  H01L31/02327 ,  H01L31/03048 ,  H01L31/035227 ,  H01L31/035236 ,  H01L31/0392 ,  H01L31/1848 ,  H01L31/1852 ,  H01L33/007 ,  H01L33/08 ,  H01L33/12 ,  H01L33/30 ,  H01L33/32 ,  H01L33/405 ,  H01L33/42 ,  H01L33/46 ,  H01L33/642 ,  H01L33/382 ,  H01L2933/0091 ,  H01S5/3054 ,  H01S5/3086 ,  H01S5/34333

摘要： An optoelectronic device configured for improved light extraction through a region of the device other than the substrate is described. A group III nitride semiconductor layer of a first polarity is located on the substrate and an active region can be located on the group III nitride semiconductor layer. A group III nitride semiconductor layer of a second polarity, different from the first polarity, can located adjacent to the active region. A first contact can directly contact the group III nitride semiconductor layer of the first polarity and a second contact can directly contact the group III nitride semiconductor layer of the second polarity. Each of the first and second contacts can include a plurality of openings extending entirely there through and the first and second contacts can form a photonic crystal structure. Some or all of the group III nitride semiconductor layers can be located in nanostructures.

公开(公告)号：US12089381B2

公开(公告)日：2024-09-10

申请号：US17993196

申请日：2022-11-23

申请人： LG DISPLAY CO., LTD.

发明人： Da-Hye Ha

IPC分类号： H05K7/20 ,  H01L33/64 ,  H05K5/00 ,  H05K7/14 ,  H10K50/87

CPC分类号： H05K7/20963 ,  H01L33/642 ,  H05K5/0017 ,  H05K7/1427 ,  H10K50/87

摘要： A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board.

公开(公告)号：US20240290931A1

公开(公告)日：2024-08-29

申请号：US18589218

申请日：2024-02-27

申请人： LG Display Co., Ltd.

发明人： Eunjeong YANG ,  SeungBum HEO

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/62 ,  H05K7/20

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L33/62 ,  H05K7/20963

摘要： A display device according to an exemplary embodiment of the present disclosure includes a display panel in which an active area and a non-active area are defined. The display device includes a cover bottom which supports the display panel on a rear surface of the display panel. The display device includes a plate bottom disposed in an opening of the cover bottom. The display device includes a printed circuit board disposed on a rear surface of the plate bottom. The display device includes a cover shield disposed to cover the printed circuit board on the rear surface of the cover bottom. A plurality of first vent holes and a plurality of first heat dissipation fins are disposed in a part of the plate bottom, thereby effectively discharging the heat of a heat generating unit.

公开(公告)号：US20240282903A1

公开(公告)日：2024-08-22

申请号：US18613195

申请日：2024-03-22

申请人： BOE MLED Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Shaofei GUO ,  Ping LI ,  Shipeng WANG ,  Bo GAO ,  Chao TIAN ,  Xuehai QIAN ,  Xiaozhou LIU ,  Baoxin ZHANG ,  Qian ZHANG

IPC分类号： H01L33/64 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16

CPC分类号： H01L33/644 ,  H01L23/4985 ,  H01L23/5387 ,  H01L25/167 ,  H01L33/641

摘要： The present disclosure provides a display panel, including: a drive substrate; a plurality of light-emitting elements on one side of the drive substrate; a functional assembly on a side of the drive substrate away from the light-emitting elements and connected to the drive substrate; where in a direction parallel to a plane where the drive substrate is located, the functional assembly has a heat conductivity higher than the drive substrate. An embodiment of the present disclosure further provides a display panel subassembly and a display apparatus.

公开(公告)号：US12040426B2

公开(公告)日：2024-07-16

申请号：US17280869

申请日：2019-09-20

申请人： Najing Technology Corporation Limited

发明人： Yongyin Kang ,  Xiangpeng Du ,  Hailin Wang ,  Jianhai Zhou ,  Yunjian Lan

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/64

CPC分类号： H01L33/0093 ,  H01L33/507 ,  H01L33/56 ,  H01L33/641 ,  H01L2933/0041 ,  H01L2933/005

摘要： This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.

公开(公告)号：US20240230252A1

公开(公告)日：2024-07-11

申请号：US18563626

申请日：2021-05-26

申请人： NISSAN MOTOR CO., LTD.

发明人： Tetsuro NAITO ,  Yoshiko TSUKADA ,  Takako KANEKO ,  Atsuhiko YAJIMA ,  Kazuyuki SHIRATORI

IPC分类号： F28F21/02 ,  C08J5/18 ,  C08K3/04 ,  C08K7/00 ,  C09K5/14 ,  H01L33/64 ,  H05K7/20

CPC分类号： F28F21/02 ,  C08J5/18 ,  C09K5/14 ,  H01L33/641 ,  H01L33/644 ,  H05K7/2039 ,  C08J2309/06 ,  C08K3/042 ,  C08K7/00

摘要： Provided is a means capable of selectively improving thermal conductivity in a surface direction of a heat conduction sheet.
A heat conduction film is configured by disposing a scale-like carbon material formed of a plurality of graphene layers and a binder such that adjacent scale-like carbon materials are in contact with each other and a long axis of the scale-like carbon material is oriented in plane direction of the film, and further making at least a part of a minor diameter of the binder or a minor diameter of a void formed by the scale-like carbon material and the binder smaller than a minor diameter of the scale-like carbon material.