Invention Grant
- Patent Title: Shorting pattern between pads of a camera module
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Application No.: US16136315Application Date: 2018-09-20
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Publication No.: US10779403B2Publication Date: 2020-09-15
- Inventor: Masahito Morita , Steven Webster
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Kligler & Associates Patent Attorneys Ltd
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/11 ; H05K3/34 ; H04N5/225 ; H05K3/30

Abstract:
An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.
Public/Granted literature
- US20200100359A1 Shorting Pattern between Pads of a Camera Module Public/Granted day:2020-03-26
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