Invention Grant
- Patent Title: Multi-layer thermal insulator apparatus and methods
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Application No.: US15582010Application Date: 2017-04-28
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Publication No.: US10781753B2Publication Date: 2020-09-22
- Inventor: Scott D. Hartshorn , Keith D. Humfeld
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Hanley, Flight & Zimmerman, LLP
- Main IPC: F02C7/24
- IPC: F02C7/24 ; F02K1/64 ; F02C7/04 ; F02K3/06 ; F02K1/82 ; B64D33/04 ; B64D27/16
Abstract:
Multi-layer thermal insulator apparatus and methods are described. An example multi-layer thermal insulator includes a first thermally insulating layer, a second thermally insulating layer, and a thermally conductive layer positioned between and adjacent to the first thermally insulating layer and the second thermally insulating layer.
Public/Granted literature
- US20180313272A1 MULTI-LAYER THERMAL INSULATOR APPARATUS AND METHODS Public/Granted day:2018-11-01
Information query
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