Invention Grant
- Patent Title: Image based substrate mapper
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Application No.: US15958327Application Date: 2018-04-20
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Publication No.: US10784134B2Publication Date: 2020-09-22
- Inventor: Eng Sheng Peh , Karthik Balakrishnan , Sriskantharajah Thirunavukarasu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G06T7/00 ; H01L21/677 ; H01L21/68
Abstract:
Methods and apparatus for detecting warpage in a substrate are provided herein. In some embodiments, a warpage detector for detecting warpage in substrates includes: one or more light sources to illuminate one or more substrates when present; a camera for capturing images of exposed portions of one or more substrates when present; a motion assembly having a mounting stage for supporting the camera; and a data acquisition interface (DAI) coupled to the camera to process substrate images and detect warpage of substrates based upon the processed substrate images.
Public/Granted literature
- US20180323095A1 IMAGE BASED SUBSTRATE MAPPER Public/Granted day:2018-11-08
Information query
IPC分类:
