Invention Grant
- Patent Title: Array substrate, chip on film, display panel and display device
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Application No.: US15538712Application Date: 2016-04-29
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Publication No.: US10784187B2Publication Date: 2020-09-22
- Inventor: Hong Li , Liqiang Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5e0d7a51
- International Application: PCT/CN2016/080646 WO 20160429
- International Announcement: WO2017/133089 WO 20170810
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/495 ; H01L27/12 ; H01L27/32 ; G02F1/1362 ; G02F1/1333 ; H01L23/00 ; G04B19/04 ; H01L51/52
Abstract:
Provided are an array substrate, a chip on film, a display panel and a display device. The array substrate has a display area and a bonding area located in a periphery of the display area. The array substrate includes a plurality of first bonding pads located in the bonding area, and length directions of the first bonding pads face the display area.
Public/Granted literature
- US20180047657A1 ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND DISPLAY DEVICE Public/Granted day:2018-02-15
Information query
IPC分类:
