Invention Grant
- Patent Title: 3-dimensional flash memory with increased floating gate length
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Application No.: US16441500Application Date: 2019-06-14
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Publication No.: US10784274B1Publication Date: 2020-09-22
- Inventor: Rahul Agarwal , Srivardhan Gowda , Krishna Parat
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Finch & Maloney PLLC
- Main IPC: H01L27/1157
- IPC: H01L27/1157 ; H01L27/11556 ; H01L27/11524 ; H01L23/532 ; H01L27/11582

Abstract:
An integrated circuit memory cell includes a floating gate, a control gate, and a plurality of inter-poly dielectric (IPD) layers. The IPD layers include an IPD1 layer, an IPD2 layer, and an IPD3 layer, with the IPD2 layer interposed between the IPD1 and IPD3 layers. The IPD2 layer, which may be a nitride, does not flank the floating gate. Thus, no section of the floating gate is laterally between two sections of the IPD2 layer. Also, no section of the IPD2 layer of a first memory cell is between the floating gate of the first memory cell and a floating gate of an immediate adjacent memory cell of the same memory cell string. In some cases, an IPD4 layer is provided between the floating gate and the IPD3 layer. The IPD4 layer is relatively much thinner than layers IPD1-3 and may flank the floating gate, as may the IPD3 layer.
Information query
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