Invention Grant
- Patent Title: Printed circuit board having commoned ground plane
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Application No.: US16614048Application Date: 2018-05-15
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Publication No.: US10784608B2Publication Date: 2020-09-22
- Inventor: Jonathan E. Buck
- Applicant: SAMTEC, INC.
- Applicant Address: US IN New Albany
- Assignee: SAMTEC, INC.
- Current Assignee: SAMTEC, INC.
- Current Assignee Address: US IN New Albany
- Agency: BakerHostetler
- International Application: PCT/US2018/032693 WO 20180515
- International Announcement: WO2018/213261 WO 20181122
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R12/71 ; H01R12/72 ; H01R13/514 ; H01R13/6471 ; H01R13/6585 ; H05K1/02 ; H05K1/11

Abstract:
An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
Public/Granted literature
- US20200176905A1 PRINTED CIRCUIT BOARD HAVING COMMONED GROUND PLANE Public/Granted day:2020-06-04
Information query
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