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公开(公告)号：US20250141161A1
公开(公告)日：2025-05-01
申请号：US19008974
申请日：2025-01-03
Applicant: SAMTEC, INC.
Inventor： Jonathan E. Buck , Yasuo Sasaki , Julian Ferry , Brandon Thomas Gore
IPC: H01R13/6598 , H01R4/70 , H01R12/62 , H01R12/75 , H01R13/03 , H01R13/6461 , H01R13/6585 , H01R13/6589
Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.
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公开(公告)号：US11824294B2
公开(公告)日：2023-11-21
申请号：US17386602
申请日：2021-07-28
Applicant: Samtec, Inc.
Inventor： Jonathan E. Buck
IPC: H01R12/73 , H01R12/71 , H01R12/72 , H01R13/514 , H01R13/6471 , H01R13/6585 , H05K1/02 , H05K1/11
CPC classification number: H01R12/737 , H01R12/716 , H01R12/721 , H01R13/514 , H01R13/6471 , H01R13/6585 , H05K1/0251 , H05K1/115
Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
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公开(公告)号：US20230253737A1
公开(公告)日：2023-08-10
申请号：US18304775
申请日：2023-04-21
Applicant: SAMTEC, INC.
Inventor： Jonathan E. Buck , John Mongold
CPC classification number: H01R13/6461 , H01R12/716 , H01R12/73 , H01R13/04 , H01R13/113 , H01R24/20 , H01R24/28 , H01R2107/00
Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
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公开(公告)号：US11637400B2
公开(公告)日：2023-04-25
申请号：US16622668
申请日：2018-06-13
Applicant: SAMTEC, INC.
Inventor： Jonathan E. Buck , John Mongold
IPC: H01R13/6461 , H01R12/71 , H01R12/73 , H01R13/04 , H01R13/11 , H01R24/20 , H01R24/28 , H01R107/00
Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to be mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
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公开(公告)号：USD958092S1
公开(公告)日：2022-07-19
申请号：US29759286
申请日：2020-11-20
Applicant: Samtec, Inc.
Designer： Randall E. Musser , Jonathan E. Buck
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Patent Agency Ranking
公开(公告)号：USD950498S1
公开(公告)日：2022-05-03
申请号：US29652012
申请日：2018-11-05
Applicant: Samtec, Inc.
Designer： Randall E. Musser , Jonathan E. Buck
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公开(公告)号：USD934813S1
公开(公告)日：2021-11-02
申请号：US29716202
申请日：2019-12-06
Applicant: Samtec, Inc.
Designer： Randall E. Musser , Jonathan E. Buck
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公开(公告)号：US11081822B2
公开(公告)日：2021-08-03
申请号：US16988923
申请日：2020-08-10
Applicant: Samtec, Inc.
Inventor： Jonathan E. Buck
IPC: H01R12/73 , H01R12/71 , H01R12/72 , H01R13/514 , H01R13/6471 , H01R13/6585 , H05K1/02 , H05K1/11
Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
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公开(公告)号：USD879724S1
公开(公告)日：2020-03-31
申请号：US29647260
申请日：2018-05-11
Applicant: Samtec, Inc.
Designer： Jonathan E. Buck , John A. Mongold
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公开(公告)号：USD823814S1
公开(公告)日：2018-07-24
申请号：US29611655
申请日：2017-07-24
Applicant: Samtec, Inc.
Designer： Jonathan E. Buck , John A. Mongold
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