- Patent Title: Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board
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Application No.: US16049904Application Date: 2018-07-31
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Publication No.: US10784642B2Publication Date: 2020-09-22
- Inventor: Takahisa Hirasawa , Takayuki Furuno
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5cac2489
- Main IPC: H01R43/20
- IPC: H01R43/20 ; H05K1/02 ; H05K1/09 ; H05K1/18 ; H05K3/00 ; B23K26/21 ; H01R43/02 ; H01R12/65 ; B23K103/04 ; B23K101/36 ; H05K3/32 ; H05K3/40
Abstract:
A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.
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