Invention Grant
- Patent Title: Printed circuit board with heat sink
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Application No.: US15711707Application Date: 2017-09-21
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Publication No.: US10785864B2Publication Date: 2020-09-22
- Inventor: William Mische
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lee & Hayes P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H05K1/18 ; H05K3/00 ; B33Y80/00 ; F28F3/02 ; H05K3/10

Abstract:
Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.
Public/Granted literature
- US20190090343A1 PRINTED CIRCUIT BOARD WITH HEAT SINK Public/Granted day:2019-03-21
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