- 专利标题： Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
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申请号： US16082491申请日： 2017-03-10
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公开(公告)号： US10790217B2公开(公告)日： 2020-09-29
- 发明人: Saori Ueda , Yasuyuki Yamada
- 申请人： SEKISUI CHEMICAL CO., LTD.
- 申请人地址： JP Osaka
- 专利权人： SEKISUI CHEMICAL CO., LTD.
- 当前专利权人： SEKISUI CHEMICAL CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group, PLLC
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2bf8a6ab com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@764556b3
- 国际申请： PCT/JP2017/009816 WO 20170310
- 国际公布： WO2017/155117 WO 20170914
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L23/482 ; C09J183/04 ; C09J11/00 ; G01L9/00 ; H01L23/00 ; C09J171/02 ; C09J11/08 ; C09J9/02 ; H01L21/52 ; H01L23/31 ; C08G65/336
摘要：
Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 μm or more and 200 μm or less.
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