Invention Grant
- Patent Title: Conductive pillar shaped for solder confinement
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Application No.: US16576380Application Date: 2019-09-19
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Publication No.: US10790253B2Publication Date: 2020-09-29
- Inventor: Charles L. Arvin , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Steven Laut
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core.
Public/Granted literature
- US20200083188A1 CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT Public/Granted day:2020-03-12
Information query
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