Invention Grant
- Patent Title: Resin composition and film using same
-
Application No.: US15980245Application Date: 2018-05-15
-
Publication No.: US10791624B2Publication Date: 2020-09-29
- Inventor: Tomoaki Sawada , Takatoshi Abe , Shingo Yoshioka
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6f3561f0
- Main IPC: H05K1/02
- IPC: H05K1/02 ; C08J5/18 ; C08K7/02 ; C08L101/00 ; C09D105/16 ; C08J7/04 ; G06F3/041 ; H01B1/02 ; H01L31/0224 ; H05K1/03 ; B32B5/02 ; H01B1/24 ; C09D163/00 ; B32B15/092 ; B32B15/08 ; B32B3/12 ; B32B3/26
Abstract:
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
Public/Granted literature
- US20180263113A1 RESIN COMPOSITION AND FILM USING SAME Public/Granted day:2018-09-13
Information query
