Invention Grant
- Patent Title: Dual ultra wide band conformal electronically scanning antenna linear array
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Application No.: US15963812Application Date: 2018-04-26
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Publication No.: US10797403B2Publication Date: 2020-10-06
- Inventor: Alec Adams , Ming Chen , Lixin Cai
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Gates & Cooper LLP
- Main IPC: H01Q21/10
- IPC: H01Q21/10 ; H01Q21/06 ; H01Q5/314 ; H01Q5/48 ; H01Q5/25 ; H01Q9/20 ; H01Q9/16 ; H01Q9/06 ; H01Q19/10 ; H01Q9/28

Abstract:
A dual ultra-wideband electronically scanning antenna linear array and a method for producing same is disclosed. In one embodiment, the antenna is comprised of circuit board-based multi-layered sections with integrated feeds. A first dielectric layer or substrate has a thin metal coating on the bottom surface to form a signal ground and metal coating on the top surface where capacitively loaded radiating dipoles are etched. Each of the dipole elements are connected to an associated conductive antenna feed disposed on a bottom surface of another dielectric layer disposed below the first dielectric layer.
Public/Granted literature
- US20190334252A1 DUAL ULTRA WIDE BAND CONFORMAL ELECTRONICALLY SCANNING ANTENNA LINEAR ARRAY Public/Granted day:2019-10-31
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