Invention Grant
- Patent Title: Multi-wavelength semiconductor lasers
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Application No.: US16671303Application Date: 2019-11-01
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Publication No.: US10797468B2Publication Date: 2020-10-06
- Inventor: Geza Kurczveil , Di Liang , Raymond G. Beausoleil
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/10 ; H01S5/34 ; H01S5/065 ; H01S5/06 ; H01S5/22 ; H01S5/02 ; H01S5/068 ; H01S5/50

Abstract:
Examples disclosed herein relate to multi-wavelength semiconductor lasers. In some examples disclosed herein, a multi-wavelength semiconductor laser may include a silicon-on-insulator (SOI) substrate and a quantum dot (QD) layer above the SOI substrate. The QD layer may include and active gain region and may have at least one angled junction at one end of the QD layer. The SOI substrate may include a waveguide in an upper silicon layer and a mode converter to facilitate optical coupling of a lasing mode to the waveguide.
Public/Granted literature
- US20200067273A1 MULTI-WAVELENGTH SEMICONDUCTOR LASERS Public/Granted day:2020-02-27
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