Invention Grant
- Patent Title: Modular power module with integrated coolant passageway and assemblies thereof
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Application No.: US15962365Application Date: 2018-04-25
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Publication No.: US10798854B2Publication Date: 2020-10-06
- Inventor: Guangyin Lei , Michael W. Degner
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent David B. Kelley
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; H01L25/11 ; H02M7/00

Abstract:
Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.
Public/Granted literature
- US20190335628A1 MODULAR POWER MODULE WITH INTEGRATED COOLANT PASSAGEWAY AND ASSEMBLIES THEREOF Public/Granted day:2019-10-31
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