Conductive adhesive compositions and method for the same
Abstract:
Conductive adhesive compositions, jettable ink adhesive compositions, printed electronics incorporating the conductive adhesive compositions, and methods for preparing the same are provided. The conductive adhesive composition may include a eutectic metal alloy, an amine, and a solvent, and the eutectic metal alloy may include gallium, indium, and optionally tin.
Public/Granted literature
Information query
Patent Agency Ranking
0/0