Invention Grant
- Patent Title: Thermoelastic cooling
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Application No.: US16180649Application Date: 2018-11-05
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Publication No.: US10808159B2Publication Date: 2020-10-20
- Inventor: Ichiro Takeuchi , Jun Cui , Manfred R. Wuttig , Yiming Wu , K. Reinhard Radermacher , Yunho Hwang , Jan Muehlbauer
- Applicant: University of Maryland, College Park , Jun Cui
- Applicant Address: US MD College Park
- Assignee: University of Maryland, College Park
- Current Assignee: University of Maryland, College Park
- Current Assignee Address: US MD College Park
- Agency: Klarquist Sparkman, LLP
- Main IPC: C09K5/14
- IPC: C09K5/14 ; F25B23/00
Abstract:
A cooling system based on thermoelastic effect is provided. The system comprises a heat sink, a refrigerated space and a regenerator coupled to the refrigerated space and to the heat sink to pump heat from the refrigerated space to the heat sink. The regenerator comprises solid thermoelastic refrigerant materials capable of absorbing or releasing heat.
Public/Granted literature
- US20190085228A1 THERMOELASTIC COOLING Public/Granted day:2019-03-21
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