Invention Grant
- Patent Title: Upper plasma-exclusion-zone rings for a bevel etcher
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Application No.: US15638313Application Date: 2017-06-29
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Publication No.: US10811282B2Publication Date: 2020-10-20
- Inventor: Tong Fang , Yunsang Kim , Keechan Kim , George Stojakovic
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; H01J37/32 ; H01L21/02 ; H01L21/3065

Abstract:
An upper plasma-exclusion-zone ring for a bevel etcher is provided that is configured to etch a bevel edge of a substrate. The upper plasma-exclusion-zone ring includes a ring-shaped body and a radially-inner stepped surface. The ring-shaped body of the upper plasma-exclusion-zone ring defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The radially-inner stepped surface of the upper plasma-exclusion-zone ring extends inwardly into the ring-shaped body between the radially inner surface of the ring-shaped body and the lower surface of the ring-shaped body. The ring-shaped body is made of a material selected from a group consisting of aluminum oxide, aluminum nitride, silicon, silicon carbide, silicon nitride, and yttria.
Public/Granted literature
- US20170301565A1 UPPER PLASMA-EXCLUSION-ZONE RINGS FOR A BEVEL ETCHER Public/Granted day:2017-10-19
Information query
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