Invention Grant
- Patent Title: FIN field effect transistor (FinFET) device structure with dummy FIN structure
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Application No.: US16730320Application Date: 2019-12-30
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Publication No.: US10811318B2Publication Date: 2020-10-20
- Inventor: Tzung-Yi Tsai , Yen-Ming Chen , Tsung-Lin Lee , Chih-Chieh Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088

Abstract:
A fin field effect transistor (FinFET) device structure with dummy fin structures and method for forming the same are provided. The FinFET device structure includes an isolation structure over a substrate, and a first fin structure extended above the isolation structure. The FinFET device structure includes a second fin structure embedded in the isolation structure, and a liner layer formed on sidewalls of the first fin structures and sidewalls of the second fin structures. The FinFET device structure includes a material layer formed over the second fin structures, and the material layer and the isolation structure are made of different materials.
Public/Granted literature
- US20200144126A1 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH DUMMY FIN STRUCTURE Public/Granted day:2020-05-07
Information query
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