Invention Grant
- Patent Title: Method for cutting polarizing plate and polarizing plate cut using same
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Application No.: US15315705Application Date: 2015-09-22
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Publication No.: US10821553B2Publication Date: 2020-11-03
- Inventor: Beom Seok Lee , Eung Jin Jang , Sukjae Lee , Kyoung Sik Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c1c8230
- International Application: PCT/KR2015/009964 WO 20150922
- International Announcement: WO2016/052902 WO 20160407
- Main IPC: B23K26/28
- IPC: B23K26/28 ; B23K26/0622 ; G02B5/30 ; B23K26/073 ; B23K26/402 ; B23K26/06 ; B23K26/38 ; B23K103/00 ; B23K103/16 ; B23K101/00 ; B23K101/34
Abstract:
A method of cutting a polarizing plate by using a laser, and a polarizing plate cut using the same. A beam shape of the laser is configured to have an elliptical shape and a major axis of the elliptical shape parallel to a cutting direction to provide excellent cross-sectional quality and improved productivity.
Public/Granted literature
- US20170120389A1 METHOD FOR CUTTING POLARIZING PLATE AND POLARIZING PLATE CUT USING SAME Public/Granted day:2017-05-04
Information query
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