Invention Grant
- Patent Title: Ejector heat pump
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Application No.: US15736586Application Date: 2016-06-16
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Publication No.: US10823463B2Publication Date: 2020-11-03
- Inventor: Hongsheng Liu , Parmesh Verma , Thomas D. Radcliff
- Applicant: Carrier Corporation
- Applicant Address: US FL Palm Beach Gardens
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US FL Palm Beach Gardens
- Agency: Bachman & LaPointe, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1a3c9116
- International Application: PCT/US2016/037822 WO 20160616
- International Announcement: WO2017/007585 WO 20170112
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B41/00 ; F25B41/04 ; F04F5/46 ; F25B9/00 ; F25B9/08

Abstract:
A vapor compression system (200; 400; 600; 700; 800; 900; 1000) comprises a plurality of valves (260, 262, 264; 260) controllable to define a first mode flowpath and a second mode flowpath. The first mode flowpath is sequentially through: a compressor (22); a first heat exchanger (30); a first nozzle (228; 624); and a separator (48), and then branching into: a first branch returning to the compressor; and a second branch passing through an expansion device (70) and a second heat exchanger (64) to the rejoin the flowpath between the first heat exchanger and the separator. The second mode flowpath is sequentially through: the compressor; the second heat exchanger; a second nozzle (248; 625); and the separator, and then branching into: a first branch returning to the compressor; and a second branch passing through the expansion device and first heat exchanger to the rejoin the flowpath between the first heat exchanger and the separator.
Public/Granted literature
- US20180187929A1 Ejector Heat Pump Public/Granted day:2018-07-05
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